Indian defence engineering company Paras Defence and Space Technologies said on Wednesday its semiconductor unit would invest ₹6,200 crore ($643.79 million) to set up a chip packaging and testing facility in Madhya Pradesh.
Paras Semiconductors, a subsidiary of the company, signed a memorandum of understanding with the Madhya Pradesh government’s department of science and technology to jointly set up an outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region.
An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.
The facility will undertake advanced chip packaging operations and test the packaged chips for reliability, the company said.
Published on July 22, 2026
